TSMC and Arizona, U.S.-based Amkor Technology have signed a Memorandum of Cooperation (MOC) to expand advanced packaging and testing according to an announcement on Friday.
The agreement includes plans to build a new factory in Peoria, Arizona, which TSMC will use to provide turnkey advanced packaging and test services and integrated fan-out (InFO) and CoWoS technologies to customers. Taiwan Industry Economics Services database director Liu Pei-chen (劉佩真) pointed out in an interview that TSMC can use this cooperation to meet the "Made in America" expectations of the U.S. government while also extending the scope of products and potentially providing services to nearby companies.
TSMC emphasized that it has maintained a close relationship with Amkor for a long time and the close cooperation between the two parties will shorten the overall production time. Senior Vice President and Business Development and Global Business Deputy Chief Operating Officer Chang Hsiao-chiang (張曉強) pointed out that customers are increasingly reliant on advanced packaging technology to achieve breakthroughs in AI, high-performance computing, and mobile applications. He said that the company looks forward to working closely with Amkor to maximize the value of TSMC’s Phoenix wafer manufacturing plant and provide more complete services to American customers.
Amkor President and CEO Giel Rutten said that this expanded partnership demonstrates their determination to promote innovation and advanced semiconductor technology while ensuring the resilience of the supply chain.