Taiwan Semiconductor Manufacturing Corporation (TSMC) held a groundbreaking ceremony for its new semiconductor fabrication plant in Dresden, Germany on Tuesday. This significant investment by TSMC has sparked interest among several Taiwanese tech companies, who are now exploring further investment opportunities in Europe.
In a press release issued on the same day, TSMC announced that the new plant will be a joint venture with Bosch, Infineon, and NXP. TSMC Chairman and CEO C.C. Wei (魏哲嘉) stated that the facility will address the semiconductor needs of Europe’s rapidly growing automotive and industrial sectors. He says that the plant's advanced manufacturing capabilities will stimulate regional economic development and drive technological progress across Europe.
With the establishment of the Dresden fab, Taiwanese semiconductor equipment and material suppliers are also expanding their presence in Europe. Companies such as Marketech, MA-tek, Gudeng Precision, Scientech, and Topco have announced plans to set up offices, warehouses, and labs across the continent.
The total investment in the Dresden plant is over 10 billion euros, with TSMC holding a 70% share, and Bosch, Infineon, and NXP each holding 10%. Construction is expected to begin in the last quarter of this year. Once operational, the plant is projected to achieve a monthly production capacity of 40,000 12-inch wafers using TSMC’s process technologies.